Invention Publication
- Patent Title: ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT
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Application No.: US18769032Application Date: 2024-07-10
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Publication No.: US20240361703A1Publication Date: 2024-10-31
- Inventor: Mohamed SWILLAM , Stephen ROUX , Tamer Mohamed Tawfik Ahmed Mohamed ELAZHARY , Arie Jeffrey DEN BOEF
- Applicant: ASML Holding N.V. , ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven; NL Veldhoven
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G02B6/122 ; G02B26/08

Abstract:
A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.
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