Invention Publication
- Patent Title: POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
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Application No.: US18759008Application Date: 2024-06-28
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Publication No.: US20240355745A1Publication Date: 2024-10-24
- Inventor: Kemal AYGUN , Zhiguo QIAN , Jianyong XIE
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L25/065 ; H01L25/075 ; H01L25/16
Abstract:
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.
Information query
IPC分类:
