According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a bonding layer provided between the ceramic dielectric substrate and the base plate. At least one of the following first to sixth conditions is satisfied: First condition: An elongation percentage α1 is not less than 120%; Second condition: A ratio α1/α2 of the elongation percentage is not less than 0.60; Third condition: A bonding strength β1 is not less than 0.4 MPa and not more than 10 MPa; Fourth condition: A ratio β1/β2 of the bonding strength is not less than 0.6 and not more than 10; Fifth condition: An elastic modulus γ1 is not less than 0.1 MPa and not more than 10 MPa; Sixth condition: A ratio γ1/γ2 of the elastic modulus is not less than 0.6 and not more than 30.