The present disclosure is directed to an optical sensor package with light shielding material covering five sides. The optical sensor package includes a transparent layer, a substrate layer, sensor elements between the transparent layer and the substrate layer, a solder mask on the side of the substrate layer opposite the transparent layer, and layer of molding material covering five sides of the optical sensor package. The solder mask and layer of molding material prevent light from entering the sides of the optical sensor package or from traveling through the substrate layer and reflecting toward the sensor elements.