Provided is a bonding apparatus. The bonding apparatus includes a first stage on which a display panel including a first mark is disposed, a pressing part disposed above the first stage and configured to provide a data driver including a second mark on the display panel, and an alignment camera disposed below the first stage. When the data driver is provided on the display panel such that the data driver and the display panel are connected to each other, the alignment camera is configured to capture images of the first mark and the second mark at a same temporal instance.