- 专利标题: THERMALLY CONDUCTIVE SHEET PRODUCT AND METHOD FOR PRODUCING SAME
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申请号: US18579081申请日: 2022-07-04
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公开(公告)号: US20240316910A1公开(公告)日: 2024-09-26
- 发明人: Hidenori KOSHIKAWA , Akihiro ENDO
- 申请人: Shin-Etsu Chemical Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21116031 2021.07.14
- 国际申请: PCT/JP2022/026593 2022.07.04
- 进入国家日期: 2024-01-12
- 主分类号: B32B27/08
- IPC分类号: B32B27/08 ; B32B27/36 ; B32B33/00 ; B32B37/24 ; B32B37/26 ; B32B38/00
摘要:
The present invention provides: a thermally conductive sheet product wherein both surfaces of a fluorine rubber-based thermally conductive sheet are protected from foreign substances and the like, and excellent setting workability is achieved between a heat generation member and a heat dissipation member; and a method for producing this thermally conductive sheet product.
A thermally conductive sheet product which is obtained by bonding electrically insulating films to both surfaces of a thermally conductive sheet that is formed of a cured product of a thermally conductive fluorine-containing curable composition containing
(A) a linear polyfluoro compound which comprises two or more alkenyl groups in each molecule, while having a perfluoro polyether structure in the main chain,
(B) a fluorine-containing organohydrogen siloxane which comprises a perfluoroalkyl group or a perfluorooxyalkyl group in each molecule, or alternatively comprises a perfluoroalkylene group or a perfluorooxyalkylene group, while additionally containing two or more groups (SiH groups), wherein a hydrogen atom is directly bonded to a silicon atom, in each molecule, and which does not comprise an alkoxy group that is directly bonded to a silicon atom in the molecule.
(C) a platinum group metal-based catalyst and
(D) a specific amount of a thermally conductive filler.
A thermally conductive sheet product which is obtained by bonding electrically insulating films to both surfaces of a thermally conductive sheet that is formed of a cured product of a thermally conductive fluorine-containing curable composition containing
(A) a linear polyfluoro compound which comprises two or more alkenyl groups in each molecule, while having a perfluoro polyether structure in the main chain,
(B) a fluorine-containing organohydrogen siloxane which comprises a perfluoroalkyl group or a perfluorooxyalkyl group in each molecule, or alternatively comprises a perfluoroalkylene group or a perfluorooxyalkylene group, while additionally containing two or more groups (SiH groups), wherein a hydrogen atom is directly bonded to a silicon atom, in each molecule, and which does not comprise an alkoxy group that is directly bonded to a silicon atom in the molecule.
(C) a platinum group metal-based catalyst and
(D) a specific amount of a thermally conductive filler.
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