In a dipole antenna, a capacitive coupling element is introduced in the form of a conductive strip and is placed in parallel with the dipole conductive strip of the dipole arm. To that end, the conductive strip of the capacitive element is formed on a first copper layer of the PCB in parallel to an extended conductive strip of a dipole arm, that is also disposed on the first copper layer of the PCB. The conductive strip of the capacitive element extends horizontally from the center of the dipole arm in an equal distant on each side. A capacitive plate is placed on the second copper layer of the PCB on the opposite side of the first copper layer and is coupled to the conductive strip of the capacitive element via a plated through hole. The capacitive plate placed on the second copper layer extends downwardly so that a portion of it overlaps with the dipole conductive strip located on the first copper layer forming the capacitance coupling element.