Invention Publication
- Patent Title: DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS
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Application No.: US18443517Application Date: 2024-02-16
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Publication No.: US20240287668A1Publication Date: 2024-08-29
- Inventor: Se Jun PARK , Do Hyung KIM , Se-Ung MIN , Ju Hwan PARK , Myung Seok SONG , Moon Seok JANG , Young Soo JUNG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230020749 2023.02.16 KR 20230052646 2023.04.21
- Main IPC: C23C14/06
- IPC: C23C14/06 ; C23C14/34 ; C23C14/50 ; C23C16/27 ; C23C16/44 ; H01L21/02 ; H01L21/67 ; H01L21/683

Abstract:
A DLC film deposition apparatus comprises a chamber in which processes are performed, a substrate in the chamber, the substrate having a first surface facing the top of the chamber, and a second surface opposite to the first surface, a holder in the chamber, the holder configured to support the substrate while being in contact with part of the second surface of the substrate, and a DLC film generator below the substrate, in the chamber, the DLC film generator configured to deposit a DLC film on the second surface of the substrate, wherein the DLC film is formed on the part of the second surface of the substrate that is not in contact with the holder.
Public/Granted literature
- US1262377A Amusement device. Public/Granted day:1918-04-09
Information query
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