Invention Publication
- Patent Title: Novel diamine compound having low hygroscopicity and low dielectric constant, its polymer, and polyimide film using the polymer
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Application No.: US18477758Application Date: 2023-09-29
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Publication No.: US20240199532A1Publication Date: 2024-06-20
- Inventor: Chang Sik HA , Jun Seok LEE , Sung Soo PARK , Amol Maruti JADHAV , Yong Zhu YAN
- Applicant: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Applicant Address: KR Busan
- Assignee: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Current Assignee: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Current Assignee Address: KR Busan
- Priority: KR 20220125434 2022.09.30 KR 20230001089 2023.01.04
- Main IPC: C07C229/60
- IPC: C07C229/60 ; C08G73/10 ; C08J5/18
Abstract:
Disclosed are a novel diamine compound, a polyimide precursor produced using the same, polyimide produced from the polyimide precursor, and a polyimide film manufactured using the polyimide. The novel diamine compound is represented by a following Chemical Formula 1:
where in the Chemical Formula 1, each of R1 and R2 independently represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or a trifluoromethyl group.
where in the Chemical Formula 1, each of R1 and R2 independently represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or a trifluoromethyl group.
Information query
