Invention Publication
- Patent Title: ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT
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Application No.: US18064954Application Date: 2022-12-13
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Publication No.: US20240194691A1Publication Date: 2024-06-13
- Inventor: Ruilong Xie , Tao Li , Nicholas Alexander POLOMOFF , Chih-Chao Yang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A first backside power rail directly below and connected to a first source-drain epitaxy region of a positive field effect transistor (p-FET) region via a first backside contact vertically aligned with the first source-drain epitaxy region, the first backside power rail directly contacts an upper horizontal surface of the first backside contact and the first backside power rail directly contacts a vertical side surface of the first backside contact. Forming a first backside power rail directly below and connected to a first source-drain epitaxy region of a positive field effect transistor (p-FET) region via a first backside contact vertically aligned with the first source-drain epitaxy region, where the first backside power rail directly contacts an upper horizontal surface of the first backside contact and the first backside power rail directly contacts a vertical side surface of the first backside contact.
Information query
IPC分类: