Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE
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Application No.: US18439747Application Date: 2024-02-12
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Publication No.: US20240186226A1Publication Date: 2024-06-06
- Inventor: Soonheung BAE , Hyunjoung KIM
- Applicant: Advanced Semiconductor Engineering Korea, Inc.
- Applicant Address: KR Paju-Si
- Assignee: Advanced Semiconductor Engineering Korea, Inc.
- Current Assignee: Advanced Semiconductor Engineering Korea, Inc.
- Current Assignee Address: KR Paju-Si, Gyeonggi-Do
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/13 ; H01L23/31 ; H01L23/538 ; H01L25/065
Abstract:
A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
Information query
IPC分类:
