Invention Publication
- Patent Title: CUTTING DEVICE AND CUTTING METHOD
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Application No.: US18284393Application Date: 2022-01-18
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Publication No.: US20240149484A1Publication Date: 2024-05-09
- Inventor: Ryuta ABE , Tatsuya MASADA , Masahide MARUYAMA
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP 21054942 2021.03.29
- International Application: PCT/JP2022/001546 2022.01.18
- Date entered country: 2023-09-27
- Main IPC: B26D11/00
- IPC: B26D11/00 ; B26D1/08 ; B26D1/36 ; B26D3/08 ; B26D7/20 ; H01G11/28 ; H01G11/86 ; H01M4/04 ; H01M4/139

Abstract:
A cutting device a device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a first process unit that causes a first cutting blade to form an incision in the first active material layer; and a second process unit that causes a second cutting blade to cut the continuous body.
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