Invention Publication
- Patent Title: ATOMIZATION MODULE
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Application No.: US18486169Application Date: 2023-10-13
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Publication No.: US20240123462A1Publication Date: 2024-04-18
- Inventor: CHIA-CHIEN CHANG , HSIN-YI PAI , CHUN-CHIA JUAN
- Applicant: HCMed Innovations Co., LTD.
- Applicant Address: TW Taipei City
- Assignee: HCMed Innovations Co., LTD.
- Current Assignee: HCMed Innovations Co., LTD.
- Current Assignee Address: TW Taipei City
- Priority: CN 2311175135.7 2023.09.13
- Main IPC: B05B17/00
- IPC: B05B17/00 ; A61M11/00

Abstract:
An atomization module includes a base, an auxiliary fixing member, an atomization member, a piezoelectric element, a conductive member, and a waterproof member. The base includes a support portion and an outer annular portion. The support portion has a first opening, the outer annular portion surrounds the support portion, and the support portion protrudes relative to the outer annular portion. The auxiliary fixing member is disposed on the support portion, and has a second opening. The second opening is opposite to the first opening. The atomization member is disposed between the support portion and the auxiliary fixing member. The piezoelectric element is disposed on the outer annular portion, and the piezoelectric element and the atomization member are disposed on a same side of the base. The conductive member is electrically connected to the piezoelectric element. The waterproof member at least partially covers the piezoelectric element.
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