- 专利标题: ELECTRONIC CIRCUIT BOARD, BASE MEMBER, ELECTRONIC EQUIPMENT, ELECTRONIC EQUIPMENT MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT BOARD MANUFACTURING METHOD
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申请号: US17754819申请日: 2020-10-22
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公开(公告)号: US20240107677A1公开(公告)日: 2024-03-28
- 发明人: HIIZU OHTORII , HIROSHI MORITA , YUSUKE OYAMA , EIJI OTANI , KEN KIKUCHI
- 申请人: SONY GROUP CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址: JP TOKYO
- 专利权人: SONY GROUP CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人: SONY GROUP CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP 19192611 2019.10.23
- 国际申请: PCT/JP2020/039704 2020.10.22
- 进入国家日期: 2022-04-13
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K1/02
摘要:
The present technology relates to an electronic circuit board, a base member, electronic equipment, an electronic equipment manufacturing method and an electronic circuit board manufacturing method that make it possible to mount an electronic circuit board easily on a curved surface, for example. An electronic circuit board has a deformable wiring board having a plurality of areas that is long in one direction and is formed to be partially continuous with each other, and the plurality of areas of the wiring board is provided with deformable plate-like plate members that are more rigid than the wiring board. For example, the present technology can be applied to an electronic circuit board on which various devices are mounted.
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