Invention Publication
- Patent Title: ELECTRONIC DEVICE INCLUDING SOUND MODULE
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Application No.: US18499653Application Date: 2023-11-01
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Publication No.: US20240064457A1Publication Date: 2024-02-22
- Inventor: Youngbae PARK , Joonrae CHO , Jihoon SONG , Byounghee LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210058336 2021.05.06
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R1/02

Abstract:
Disclosed is an electronic device including a sound module. The electronic device comprises: a housing in which at least one sound hole is formed; and a sound component mounted on the housing adjacent to the sound hole and configured to emit sound in a first direction toward the outside of the housing through the sound hole. The sound component includes: a sound frame forming a front surface open in the first direction; a center diaphragm disposed in the front space such that the front surface thereof faces the first direction; a vibration module including a loop disposed on the rear surface of the center diaphragm and configured to apply vibrations to the center diaphragm; and a sealing part including a seal that connects the center diaphragm and the sound frame along the circumference of the center diaphragm and provides a seal between the housing and the sound frame through a portion connected to the sound frame, wherein the sound frame and the center diaphragm may include the same material.
Information query
IPC分类: