Invention Publication
- Patent Title: BOARD-TO-BOARD CONNECTOR
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Application No.: US18297700Application Date: 2023-04-10
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Publication No.: US20240055811A1Publication Date: 2024-02-15
- Inventor: Tomoyasu YANASE , Kiyoshi ASAI , Naoyuki ONO
- Applicant: SMK Corporation
- Applicant Address: JP Tokyo
- Assignee: SMK Corporation
- Current Assignee: SMK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22127640 2022.08.10
- Main IPC: H01R13/6597
- IPC: H01R13/6597 ; H01R12/71 ; H01R13/6471

Abstract:
Provided is a board-to-board connector including a housing having a protrusion, one or more signal terminals held on the housing such that a contact portion is exposed to the side of the protrusion, a high-frequency signal terminal arranged outside an end portion of the protrusion, and a shell surrounding an outer peripheral portion of the housing and made of a conductive metal material. In the board-to-board connector, the shell integrally includes a GND terminal portion having a plate-shaped board-side shielding portion arranged on a bottom portion outside the end portion of the protrusion and a plate-shaped GND terminal body standing on the protrusion-side end of the board-side shielding portion and arranged closer to the protrusion with respect to the high-frequency signal terminal, and a high-frequency signal terminal housing hole in which the high-frequency signal terminal is arranged is formed in the board-side shielding portion.
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