- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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申请号: US18472187申请日: 2023-09-21
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公开(公告)号: US20240015979A1公开(公告)日: 2024-01-11
- 发明人: Chia-Yu Ling , Katherine H. CHIANG , Chung-Te Lin
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US17460294 2021.08.29
- 主分类号: H10B51/30
- IPC分类号: H10B51/30 ; H10B51/20 ; H10B51/10 ; H01L29/66
摘要:
A method of manufacturing a memory cell includes the following steps. A channel material is formed to contact a source line and a bit line. A ferroelectric (FE) material is formed to contact the channel material. A word line is formed to contact the FE material. The FE material is disposed between the channel material and the word line. The word line includes a bulk layer. The bulk layer includes a first metal layer and a second metal layer. The second metal layer is sandwiched between the first metal layer and the FE material.
公开/授权文献
- US12120884B2 Semiconductor device and method of manufacturing the same 公开/授权日:2024-10-15
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