Invention Application
- Patent Title: COATED PAPER SUBSTRATE SUITABLE FOR METALLIZATION
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Application No.: US17996940Application Date: 2021-05-06
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Publication No.: US20230131438A1Publication Date: 2023-04-27
- Inventor: Kaj Backfolk , Isto Heiskanen , Katja Lyytikäinen
- Applicant: Stora Enso OYJ
- Applicant Address: FI Helsinki
- Assignee: Stora Enso OYJ
- Current Assignee: Stora Enso OYJ
- Current Assignee Address: FI Helsinki
- Priority: SE2050524-4 20200507
- International Application: PCT/IB2021/053830 WO 20210506
- Main IPC: D21H19/34
- IPC: D21H19/34 ; D21H27/10 ; D21H23/56 ; D21H23/54
Abstract:
The present invention is directed to a coated paper substrate that is particularly suitable for metallization and other nano-coatings that provide barrier properties and are applied using vacuum deposition techniques. The invention is also directed to a process for preparing the coated paper substrate. The invention is also directed to a packaging material comprising the coated paper substrate.
Information query
