A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.