A method of curing polyimide, polyimide copolymers, polyimide composites or combinations is provided. The method involves preparing a reaction system comprising poly(amic acid) and at least one other compound selected from the group consisting of copolymers, solvents, fillers and nanofillers. Then, a combined overall microwave absorptivity of the reaction system is determined. A temperature ramp rate is calculated for a microwave power level and time using the combined overall microwave absorptivity. The reaction system is then exposed to microwave radiation according to the calculated temperature ramp rate, producing a cured product.