Integrated circuit (IC) packages with On Package Memory (OPM) architectures are disclosed herein. An example IC package includes a substrate having a first side and a second side opposite the first side, a semiconductor die mounted on the first side of the substrate, and a die pad on the first side of the substrate. The die is electrically coupled to the die pad. The IC package also includes a memory pad on the first side of the substrate. The memory pad is to be electrically coupled to a memory mounted on the first side of the substrate. The IC package further includes a ball on the second side of the substrate, and a memory interconnect in the substrate electrically coupling the die pad, the memory pad, and the ball.