- 专利标题: MODULAR HEADSET ASSEMBLY
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申请号: US17480762申请日: 2021-09-21
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公开(公告)号: US20230085688A1公开(公告)日: 2023-03-23
- 发明人: Robert Dean THACKER , Evan Alexander BENNIS , Clare DONAHER , Robert MALINOSKI
- 申请人: Honeywell International Inc.
- 申请人地址: US NC Charlotte
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NC Charlotte
- 主分类号: H04R5/033
- IPC分类号: H04R5/033 ; H04R1/10 ; G06F3/16

摘要:
Various embodiments are directed to a modular headset assembly comprising a headband, a detachable audio module in wired communication with a computing device via a cord coupled to the detachable audio module, the detachable audio module being detachably secured relative to the headband and comprising: a module housing; and a cord retention element disposed within an interior of the module housing and comprising an at least partially dynamic configuration relative to the module housing defined at least in part by a range of relative rotational motion between the cord retention element and the module housing, wherein the cord retention element may rotate within the module housing at least partially independently of an angular configuration of the module housing; wherein the cord is engaged with the cord retention element such that the cord retention element may rotates along the range of relative rotational motion based on forces acting on the cord.
公开/授权文献
- US3196716A Carton blanking die and method of making 公开/授权日:1965-07-27
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