Disclosed herein is a semiconductor chip including a power transistor, a plurality of pads, a plurality of wires arranged to establish continuity between each of the plurality of pads and a first end or a second end of the power transistor, a current detection circuit configured to detect, as a sense voltage, at least one of voltage drops caused in each of the plurality of wires according to a branch current flowing through the wire and a wire resistance component of the wire, and a logic configured to determine a condition of wire bonding of each of the plurality of pads according to a result of the detection by the current detection circuit.