Invention Publication
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Application No.: US17864325Application Date: 2022-07-13
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Publication No.: US20230402537A1Publication Date: 2023-12-14
- Inventor: Huai-Tzu Chiang , Kai Lin Lee , Zhi-Cheng Lee , Chuang-Han Hsieh
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Priority: CN 2210672388.4 2022.06.14
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66

Abstract:
A high electron mobility transistor (HEMT) device includes a substrate, a channel layer, a source, a drain, a buffer layer, and a plurality of amorphous regions. The channel layer is located above the substrate. The source is located on the channel layer. The drain is located on the channel layer. The buffer layer is located between the substrate and the channel layer. The plurality of amorphous regions are located in the buffer layer below the source and the drain.
Information query
IPC分类: