• Patent Title: MODULAR COMPARTMENT PILLOW WITH MULTI-LAYERED PADS
  • Application No.: US18330132
    Application Date: 2023-06-06
  • Publication No.: US20230389732A1
    Publication Date: 2023-12-07
  • Inventor: Jia Wei Yu
  • Applicant: Jia Wei Yu
  • Applicant Address: CA York
  • Assignee: Jia Wei Yu
  • Current Assignee: Jia Wei Yu
  • Current Assignee Address: CA York
  • Main IPC: A47G9/10
  • IPC: A47G9/10
MODULAR COMPARTMENT PILLOW WITH MULTI-LAYERED PADS
Abstract:
A modular compartment pillow includes a main body, a plurality of compartments housed in a cavity in the main body, and at least one opening. The opening provides access to at least one compartment.
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