发明公开
- 专利标题: COOLING UNIT
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申请号: US18202322申请日: 2023-05-26
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公开(公告)号: US20230389228A1公开(公告)日: 2023-11-30
- 发明人: Keisuke KAWATA , Toshihiko TOKESHI , Takehito TAMAOKA
- 申请人: Nidec Corporation
- 申请人地址: JP Kyoto
- 专利权人: Nidec Corporation
- 当前专利权人: Nidec Corporation
- 当前专利权人地址: JP Kyoto
- 优先权: JP 22087047 2022.05.27
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A cooling assembly is connectable with a cold plate that comes into thermal contact with a heat source, and includes a first manifold, a second manifold, and a radiator. The first manifold causes a refrigerant having circulated through a first pipe to flow out from outflow ports toward the cold plate. In the second manifold, the refrigerant flowing into inflow ports from the cold plate circulates through a second pipe. In the radiator, the refrigerant having circulated through the second pipe circulates through the flow paths arranged side by side at intervals. Each of the first and second pipes opposes a portion of the radiator in the first direction.
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