发明公开
- 专利标题： Integrated Acoustic Devices
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申请号： US18315560申请日： 2023-05-11
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公开(公告)号： US20230387877A1公开(公告)日： 2023-11-30
- 发明人: Vikrant J. GOKHALE , Brian P. DOWNEY , Shawn C. MACK , D. Scott KATZER , David J. MEYER , Pallavi DHAGAT , Albrecht JANDER
- 申请人： The Government of the United States of America, as represented by the Secretary of the Navy
- 申请人地址： US VA Arlington
- 专利权人： The Government of the United States of America, as represented by the Secretary of the Navy
- 当前专利权人： The Government of the United States of America, as represented by the Secretary of the Navy
- 当前专利权人地址： US VA Arlington
- 主分类号： H03H3/02
- IPC分类号： H03H3/02 ; H03H3/007
摘要：
Method for forming an integrated acoustic device. A thin film piezoelectric acoustic transducer is epitaxially formed on a host substrate and is then transferred to a functional target substrate wherein physical phenomena from the piezoelectric transducer and the arbitrary functional substrate interact to form a hybrid acoustic microsystem comprising the piezoelectric transducer and the arbitrary functional substrate.
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