In a case where it is determined that forming processing can be performed, a curable composition on a substrate is cured by a first curing unit in a state where a member is in contact with the curable composition, the member is separated, and the curable composition is further cured by a second curing unit. In a case where it is determined that the forming processing cannot be performed, the curable composition is cured by the second curing unit in a state where the curable composition is separated from the member without the curable composition being cured by the first curing unit. This can prevent carry-out of the substrate to which an uncured composition is applied and contamination inside and outside an apparatus even in a case where normal processing cannot be performed.