发明公开
- 专利标题: PRESSURE SENSING IMPLANT
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申请号: US18205813申请日: 2023-06-05
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公开(公告)号: US20230380764A1公开(公告)日: 2023-11-30
- 发明人: Harry ROWLAND , Michael NAGY , Balamurugan SUNDARAM , Suresh SUNDARAM
- 申请人: ENDOTRONIX, INC.
- 申请人地址: US IL Lisle
- 专利权人: ENDOTRONIX, INC.
- 当前专利权人: ENDOTRONIX, INC.
- 当前专利权人地址: US IL Lisle
- 主分类号: A61B5/00
- IPC分类号: A61B5/00 ; A61B5/0215 ; A61B5/07 ; G01L19/06 ; G01L9/00 ; H05K9/00 ; B81B3/00 ; G01L19/00 ; B81C1/00
摘要:
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
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