Invention Publication
- Patent Title: NON-UNIFORM ELECTRIC FIELDS TO COMPACT METAL POWDER BUILD MATERIAL
-
Application No.: US18022093Application Date: 2020-08-18
-
Publication No.: US20230321730A1Publication Date: 2023-10-12
- Inventor: Seongsik Chang
- Applicant: Hewlett-Packard Development Company, L.P
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P
- Current Assignee: Hewlett-Packard Development Company, L.P
- Current Assignee Address: US TX Spring
- International Application: PCT/US2020/046749 2020.08.18
- Date entered country: 2023-02-17
- Main IPC: B22F12/60
- IPC: B22F12/60 ; B22F12/49 ; B22F12/90

Abstract:
In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material distributor to deposit metal powder build material on abed. The additive manufacturing system also includes at least a first electrode below the bed and a second electrode above the bed to generate a non-uniform electric field to compact deposited the metal powder build material. A hardening system of the additive manufacturing system selectively hardens metal powder build material in a pattern of a layer of a three-dimensional object to be printed.
Information query