发明公开
- 专利标题: SUBSTRATE ALIGNMENT
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申请号: US18006095申请日: 2020-07-20
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公开(公告)号: US20230278354A1公开(公告)日: 2023-09-07
- 发明人: Josep Maria BEL CALAVIA , Ignasi BONJOCH ROMA , Andreu VINETS ALONSO
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Spring
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Spring
- 国际申请: PCT/US2020/042740 2020.07.20
- 进入国家日期: 2023-01-19
- 主分类号: B41J15/16
- IPC分类号: B41J15/16 ; B65H23/18 ; B65H23/188 ; B65H23/192
摘要:
Example implementations provide a controller comprising circuitry to align a substrate; the controller comprising: circuitry to control varying the tension of an unspooled portion of the substrate between a spool bearing the substrate and a pinch roller; said circuitry comprising circuitry to control varying the pinch load exerted by the pinch roller on the unspooled portion of the substrate.
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IPC分类: