Invention Application
- Patent Title: IMAGE COLLECTION CHIP, OBJECT IMAGING RECOGNITION DEVICE AND OBJECT IMAGING RECOGNITION METHOD
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Application No.: US17950568Application Date: 2022-09-22
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Publication No.: US20230025329A1Publication Date: 2023-01-26
- Inventor: Kaiyu CUI , Xusheng CAI , Hongbo ZHU , Yidong HUANG , Wei ZHANG , Xue FENG , Fang LIU
- Applicant: TSINGHUA UNIVERSITY
- Applicant Address: CN Beijing
- Assignee: TSINGHUA UNIVERSITY
- Current Assignee: TSINGHUA UNIVERSITY
- Current Assignee Address: CN Beijing
- Priority: CN201910700328.7 20190731
- Main IPC: H04B10/516
- IPC: H04B10/516 ; H01L27/146

Abstract:
An image collection chip, an object imaging recognition device and an object imaging recognition method are provided. The image collection chip comprises an optical modulation layer and an image sensing layer. The optical modulation layer is located on the image sensing layer. The optical modulation layer is provided with at least two modulation units and the image sensing layer is provided with sensing units corresponding to the at least two modulation units in a form of up and down. Each of the at least two modulation units is provided with at least one modulation subunit. Two or more modulation units among the at least two modulation units have different graphic structures, and the two or more modulation units having different graphic structures have different modulation roles on spectrum.
Public/Granted literature
- US11881896B2 Image collection chip, object imaging recognition device and object imaging recognition method Public/Granted day:2024-01-23
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