- 专利标题： ADHESIVE SET, FILM, BONDED BODY, AND METHOD FOR SEPARATING ADHEREND
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申请号： US17926385申请日： 2021-10-06
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公开(公告)号： US20230235205A1公开(公告)日： 2023-07-27
- 发明人: Masayuki WADA , Takashi KUMAKI , Yuki MIYAMOTO , Keiichi SAKAMOTO , Shun SATO
- 申请人： Showa Denko Materials Co., Ltd.
- 申请人地址： JP Tokyo
- 专利权人： Showa Denko Materials Co., Ltd.
- 当前专利权人： Showa Denko Materials Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP 20169677 2020.10.07 JP 20169678 2020.10.07 JP 20169680 2020.10.07
- 国际申请： PCT/JP2021/037006 2021.10.06
- 进入国家日期： 2022-11-18
- 主分类号： C09J175/04
- IPC分类号： C09J175/04 ; C09J11/02
摘要：
An adhesive set is disclosed. This adhesive set includes a main agent containing a compound having two or more isocyanate groups and a curing agent containing a compound having two or more hydroxyl groups. At least one of the compound having two or more isocyanate groups and the compound having two or more hydroxyl groups has a disulfide bond in the molecule. At least one of the main agent and the curing agent further contains a curing catalyst. At least one of the main agent and the curing agent further contains a photoradical generator.
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