Invention Application
- Patent Title: Microspeaker Enclosure Including Block Formed of Porous Particles
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Application No.: US17869338Application Date: 2022-07-20
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Publication No.: US20230022009A1Publication Date: 2023-01-26
- Inventor: Yong Hee Oh , Jae Hwa Lim
- Applicant: EM-TECH Co., Ltd.
- Applicant Address: KR Gyeongsangnam-do
- Assignee: EM-TECH Co., Ltd.
- Current Assignee: EM-TECH Co., Ltd.
- Current Assignee Address: KR Gyeongsangnam-do
- Priority: KR10-2021-0095801 20210721
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R1/02

Abstract:
The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, and a porous block installed in the back volume and prepared by mixing first porous particles having excellent adsorption capacity of nitrogen or oxygen and second porous particles having a porosity of 50% or more.
Information query
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