A thin film deposition apparatus includes: a chamber configured to process a plurality of substrates; a plurality of heater members disposed to correspond to the substrates to heat the substrates, respectively; a plurality of lift pins configured to support lower surfaces of the substrates while elevating through the heater members, respectively; a plurality of heat shield plates, having a heat shield function between the heater members, on which lower ends of the lift pins are configured to be seated; and a plurality of support columns coupled with and supporting the heater members.