Invention Publication
- Patent Title: INTEGRATED CIRCUIT CONFIGURABLE TO PERFORM ADAPTIVE THERMAL CEILING CONTROL IN PER-FUNCTIONAL-BLOCK MANNER, ASSOCIATED MAIN CIRCUIT, ASSOCIATED ELECTRONIC DEVICE AND ASSOCIATED THERMAL CONTROL METHOD
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Application No.: US17993853Application Date: 2022-11-23
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Publication No.: US20230185280A1Publication Date: 2023-06-15
- Inventor: Chih-Fu Tsai , Yu-Chia Chang , Bo-Jiun Yang , Yen-Hwei Hsieh , Shun-Yao Yang , Jia-Wei Fang , Ta-Chang Liao , Tai-Yu Chen
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: G05B19/4155
- IPC: G05B19/4155

Abstract:
An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block. The thermal control circuit performs thermal control on the first functional block to prevent the first functional block from overheating and inducing abnormal function operations, by monitoring the temperature sensing result and by trying to prevent the temperature sensing result from exceeding first temperature upper-limit, wherein the first temperature upper-limit is configurable with respect to per-functional-block thermal operation capability of the first functional block.
Information query
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