• 专利标题: SUB-DERMAL JOINTING FOR COMPOSITE PANELIZED BUILDING SYSTEM AND METHOD
  • 申请号: US18080731
    申请日: 2022-12-13
  • 公开(公告)号: US20230183967A1
    公开(公告)日: 2023-06-15
  • 发明人: Mark Goulthorpe
  • 申请人: DECOi Inc.
  • 申请人地址: US MA Charlestown
  • 专利权人: DECOi Inc.
  • 当前专利权人: DECOi Inc.
  • 当前专利权人地址: US MA Charlestown
  • 主分类号: E04B1/61
  • IPC分类号: E04B1/61 E04B1/14 B32B3/04 B32B3/06
SUB-DERMAL JOINTING FOR COMPOSITE PANELIZED BUILDING SYSTEM AND METHOD
摘要:
Systems and methods are described herein for a panelized building assembly comprising a double skeleton of planar connectors, positioned parallel to and behind the inner and outer building surfaces of panels to be connected. The planar elements may be folded symmetrically about the bisected angle between adjacent surfaces so as to form a coherent and continuous double layer that can, in some cases, offers structural, fire, acoustical and waterproofing performance consistently between various panel. The connectors may extend into the mass of a block of material that forms a continuous edge around the perimeter of the panels, which is bonded continuously to the fiber-reinforced skin of the panel and to the core material that the inner and outer fiber reinforced skins are also continuously bonded to.
信息查询
0/0