- 专利标题: INTEGRATED THERMAL MANAGEMENT CIRCUIT FOR A VEHICLE
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申请号: US17701461申请日: 2022-03-22
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公开(公告)号: US20230017549A1公开(公告)日: 2023-01-19
- 发明人: Ki Mok Kim , Sang Shin Lee , Man Ju Oh , Jae Woong Kim , Uk Il Yang
- 申请人: HYUNDAI MOTOR COMPANY , KIA CORPORATION
- 申请人地址: KR Seoul; KR Seoul
- 专利权人: HYUNDAI MOTOR COMPANY,KIA CORPORATION
- 当前专利权人: HYUNDAI MOTOR COMPANY,KIA CORPORATION
- 当前专利权人地址: KR Seoul; KR Seoul
- 优先权: KR10-2021-0092685 20210715
- 主分类号: B60H1/00
- IPC分类号: B60H1/00 ; B60H1/03
摘要:
An integrated thermal management circuit for a vehicle includes a refrigerant line that causes a refrigerant to flow through a compressor, an interior condenser of an interior air conditioning device, and an exterior condenser outside the vehicle. The circuit causes the refrigerant discharged from the condenser to pass through an integrated chiller or an evaporator of the air conditioning device and to be introduced into the compressor. The circuit includes: a first cooling line causing a cooling water to circulate between a high voltage battery and a first radiator or between the high voltage battery and the integrated chiller; a second cooling line causing the cooling water to circulate between an electronic drive unit and a second radiator or between the electronic drive unit and the integrated chiller; and a bypass line provided in the first cooling line.
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