- 专利标题： COMPOSITE MATERIAL, HEAT SINK AND SEMICONDUCTOR DEVICE
-
申请号： US17917006申请日： 2021-03-03
-
公开(公告)号： US20230167528A1公开(公告)日： 2023-06-01
- 发明人: Masatoshi MAJIMA , Gouhei TOYOSHIMA , Kouichi TAKASHIMA
- 申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , A.L.M.T. Corp.
- 申请人地址： JP Osaka
- 专利权人： SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. Corp.
- 当前专利权人： SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. Corp.
- 当前专利权人地址： JP Osaka
- 优先权： JP 20070227 2020.04.09
- 国际申请： PCT/JP2021/008039 2021.03.03
- 进入国家日期： 2022-10-05
- 主分类号： C22C26/00
- IPC分类号： C22C26/00 ; C25D3/12 ; C25D7/00 ; H01L23/373
摘要：
A composite material of the present disclosure contains a plurality of diamond particles, copper, and at least one first element selected from the group consisting of silicon, chromium, cobalt, nickel, molybdenum, titanium, vanadium, niobium, tantalum tungsten and aluminum, wherein the content rate of the first element based on the total mass of the copper and the first element is 50 ppm or higher and 2,000 ppm or lower.
信息查询
