A vapor chamber reinforcement structure includes an upper cover and a lower plate. The upper cover is recessed to form at least one channel An opposite side of the channel is protruded to form at least one raised body. The lower plate is used to contact with a heat source and has a first capillary structure. The lower plate is correspondingly mated with the upper cover to form an airtight chamber for filling a working fluid. By means of the channel and the raised body disposed on the opposite side of the channel, the channel provides larger heat contact area for the heat conduction component (heat pipe) and more secure connection ability. Also, the raised body on the opposite side of the channel enhances the structural strength of the entire vapor chamber and enlarges the condensation contact area of the vapor chamber.