The radiative cooling device includes an infrared radiative layer A that radiates infrared light IR from a radiative surface H, a light reflective layer B disposed on a side opposite to the radiative surface H with respect to the infrared radiative layer A, and a protective layer D disposed between the infrared radiative layer A and the light reflective layer B. The infrared radiative layer A is a resin material layer J having a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm. The light reflective layer B contains silver or a silver alloy, and the protective layer D is formed from a polyolefin based resin with a thickness of 300 nm or more and 40 μm or less or an ethylene terephthalate resin with a thickness of 17 μm or more and 40 μm or less.