Invention Application
- Patent Title: SEMICONDUCTOR MEMORY DEVICES
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Application No.: US17535762Application Date: 2021-11-26
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Publication No.: US20220405165A1Publication Date: 2022-12-22
- Inventor: Yeonggeol Song , Sungrae Kim , Kijun Lee , Sunggi Ahn , Yesin Ryu , Sukhan Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0078606 20210617
- Main IPC: G06F11/10
- IPC: G06F11/10 ; G11C29/04

Abstract:
A semiconductor memory device includes a buffer die and a plurality of memory dies. Each of the memory dies includes a memory cell array, an error correction code (ECC) engine and a test circuit. The memory cell array includes a plurality of memory cell rows, each including a plurality of volatile memory cells. The test circuit, in a test mode, generates a test syndrome and an expected decoding status flag indicating error status of the test syndrome, receives test parity data generated by the ECC engine based on the test syndrome and a decoding status flag indicating error status of the test parity data, and determines whether the ECC engine has a defect based on comparison of the test syndrome and the test parity data and a comparison of the expected decoding status flag and the decoding status flag.
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