Invention Application
- Patent Title: SEMICONDUCTOR MEMORY DEVICES
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Application No.: US17680913Application Date: 2022-02-25
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Publication No.: US20220181330A1Publication Date: 2022-06-09
- Inventor: Hyejin SEONG , Jisuk PARK , Sungho CHOI
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0114364 20190917
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A semiconductor memory device includes a substrate having a memory cell region, a peripheral region, and a dam region between the memory cell region and the peripheral region, the memory cell region having a rectangular shape according to a top view and having a plurality of active regions defined therein; a plurality of bit line structures extending on the substrate in the memory cell region to be parallel with each other in a first horizontal direction, each including a bit line; a plurality of buried contacts filling lower portions of spaces among the plurality of bit line structures on the substrate; a plurality of landing pads on the plurality of buried contacts; and a dam structure including a first dam structure and a second dam structure in the dam region and being at the same level as the plurality of landing pads.
Public/Granted literature
- US12048146B2 Memory device with dam structure between peripheral region and memory cell region Public/Granted day:2024-07-23
Information query
IPC分类: