- 专利标题: ELECTRONIC DEVICE
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申请号: US17466872申请日: 2021-09-03
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公开(公告)号: US20220068519A1公开(公告)日: 2022-03-03
- 发明人: Hung-Yi CHEN , Yen-Ching KUO , Hong-Ming DAI , Shu-Tang YEH , Wen-lung CHEN , Jane-Hway LIAO
- 申请人: Industrial Technology Research Institute
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01B7/04
- IPC分类号: H01B7/04 ; G09F9/30
摘要:
The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.
公开/授权文献
- US11551829B2 Electronic device 公开/授权日:2023-01-10
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