Invention Application
- Patent Title: METHOD AND ARRANGEMENT FOR FORMING GROOVES IN A BOARD ELEMENT
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Application No.: US17463902Application Date: 2021-09-01
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Publication No.: US20220063167A1Publication Date: 2022-03-03
- Inventor: Per JOSEFSSON , Martin BJEREMYR , Richard JOLFSON
- Applicant: Ceraloc Innovation AB
- Applicant Address: SE Viken
- Assignee: Ceraloc Innovation AB
- Current Assignee: Ceraloc Innovation AB
- Current Assignee Address: SE Viken
- Priority: SE2051036-8 20200902
- Main IPC: B29C48/00
- IPC: B29C48/00
Abstract:
A method for forming at least one groove in a board element, wherein the board element includes a polymer-based material and, preferably, a filler. The method includes providing a board element including a board portion disposed at an elevated temperature and forming at least one groove by removing material, such as chips, from the board portion by a processing device.
Information query
