- 专利标题: HYBRID COOLING SYSTEM FOR ELECTRONIC RACKS
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申请号: US16997497申请日: 2020-08-19
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公开(公告)号: US20220061187A1公开(公告)日: 2022-02-24
- 发明人: Shuai SHAO , Tianyi GAO
- 申请人: Baidu USA LLC
- 申请人地址: US CA Sunnyvale
- 专利权人: Baidu USA LLC
- 当前专利权人: Baidu USA LLC
- 当前专利权人地址: US CA Sunnyvale
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L35/02
摘要:
According to one embodiment, a hybrid cooling system includes a cold plate that is arranged to mount on an IT component that is mounted on a piece of IT equipment, the cold plate is arranged to receive coolant via a supply line and to return warmed coolant via a return line, the warmed coolant is produced by the cold plate when the cold plate is in contact with the IT component and heat generated by the IT component is transferred into the coolant by the cold plate; a TEC element that is arranged to couple to the IT component; and a heat sink that includes a base that is arranged to couple to the TEC element and one or more fins, the TEC element is configured to transfer at least a portion of the heat generated by the IT component into the one or more fins of the heat sink.
公开/授权文献
- US11825628B2 Hybrid cooling system for electronic racks 公开/授权日:2023-11-21
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