Invention Application
- Patent Title: EPOXY RESIN COMPOSITION
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Application No.: US17281230Application Date: 2019-09-26
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Publication No.: US20210395513A1Publication Date: 2021-12-23
- Inventor: Jean-Pierre Berkan LINDNER , Szilard CSIHONY , Daniel LOEFFLER , Yeni BURK , Birgit GERKE , Frank PIRRUNG , Lucas Benjamin HENDERSON , Volodymyr BOYKO , Rui DE OLIVEIRA , Ingolf HENNIG , Miran YU
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: EP18197295.1 20180927
- International Application: PCT/EP2019/076010 WO 20190926
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/40 ; C08K3/36
Abstract:
A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.
Information query
