- 专利标题： THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, METHOD FOR PRODUCING THERMALLY CONDUCTIVE MEMBER, HEAT DISSIPATION STRUCTURE, HEAT GENERATING COMPOSITE MEMBER, AND HEAT DISSIPATING COMPOSITE MEMBER
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申请号： US17290382申请日： 2019-11-05
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公开(公告)号： US20210371660A1公开(公告)日： 2021-12-02
- 发明人: Keita ISHIDA , Gaku KITADA
- 申请人： SEKISUI POLYMATECH CO., LTD.
- 申请人地址： JP Saitama-city, Saitama
- 专利权人： SEKISUI POLYMATECH CO., LTD.
- 当前专利权人： SEKISUI POLYMATECH CO., LTD.
- 当前专利权人地址： JP Saitama-city, Saitama
- 优先权： JP2018-211300 20181109
- 国际申请： PCT/JP2019/043310 WO 20191105
- 主分类号： C08L83/04
- IPC分类号： C08L83/04 ; C09K5/14 ; C08K3/20
摘要：
There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.
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