Invention Application
- Patent Title: APPARATUSES AND METHODS OF PROTECTING NICKEL AND NICKEL CONTAINING COMPONENTS WITH THIN FILMS
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Application No.: US16846295Application Date: 2020-04-11
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Publication No.: US20210319983A1Publication Date: 2021-10-14
- Inventor: Pingyan LEI , Dien-Yeh WU , Xiao Ming HE , Jennifer Y. SUN , Lei ZHOU , Takashi KURATOMI , Avgerinos V. GELATOS , Mei CHANG , Steven D. MARCUS
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; C23C16/06 ; C23C16/44 ; C23C16/455
Abstract:
Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.
Public/Granted literature
- US11658014B2 Apparatuses and methods of protecting nickel and nickel containing components with thin films Public/Granted day:2023-05-23
Information query
