• 专利标题: BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, SLURRY COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
  • 申请号: US16973037
    申请日: 2019-06-24
  • 公开(公告)号: US20210273227A1
    公开(公告)日: 2021-09-02
  • 发明人: Maki MESUDAYukie ITO
  • 申请人: ZEON CORPORATION
  • 申请人地址: JP Chiyoda-ku, Tokyo
  • 专利权人: ZEON CORPORATION
  • 当前专利权人: ZEON CORPORATION
  • 当前专利权人地址: JP Chiyoda-ku, Tokyo
  • 优先权: JP2018-124643 20180629
  • 国际申请: PCT/JP2019/024968 WO 20190624
  • 主分类号: H01M4/62
  • IPC分类号: H01M4/62 H01M10/0525 C08L33/10 C08L33/08 C08L33/20
BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, SLURRY COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
摘要:
Provided is a binder composition for an electrochemical device electrode with which it is possible to form an electrode mixed material layer that has excellent peel strength and dusting resistance and that can cause an electrochemical device to display excellent rate characteristics. The binder composition for an electrochemical device electrode contains a binder and an organic solvent. The binder includes a particulate polymer A and a polymer B. The particulate polymer A has a core-shell structure including a core portion and a shell portion at least partially covering an outer surface of the core portion, and a polymer forming the shell portion has a glass-transition temperature of −50° C. to 20° C. A mixture obtained by mixing the polymer B in a concentration of 8 mass % with the organic solvent has a viscosity at a shear rate of 1 s−1 of 100 mPa·s to 10,000 mPa·s.
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